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TPS736xx
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SBVS038K - SEPTEMBER 2003 - REVISED SEPTEMBER 2005
Cap-Free, NMOS, 400mA Low-Dropout Regulator with Reverse Current Protection
FEATURES
* * * * * * * * * * * Stable with No Output Capacitor or Any Value or Type of Capacitor Input Voltage Range of 1.7V to 5.5V Ultra-Low Dropout Voltage: 75mV typ Excellent Load Transient Response--with or without Optional Output Capacitor New NMOS Topology Delivers Low Reverse Leakage Current Low Noise: 30VRMS typ (10Hz to 100kHz) 0.5% Initial Accuracy 1% Overall Accuracy Over Line, Load, and Temperature Less Than 1A max IQ in Shutdown Mode Thermal Shutdown and Specified Min/Max Current Limit Protection Available in Multiple Output Voltage Versions - Fixed Outputs of 1.20V to 4.3V - Adjustable Output from 1.20V to 5.5V - Custom Outputs Available
DESCRIPTION
The TPS736xx family of low-dropout (LDO) linear voltage regulators uses a new topology: an NMOS pass element in a voltage-follower configuration. This topology is stable using output capacitors with low ESR, and even allows operation without a capacitor. It also provides high reverse blockage (low reverse current) and ground pin current that is nearly constant over all values of output current. The TPS736xx uses an advanced BiCMOS process to yield high precision while delivering very low dropout voltages and low ground pin current. Current consumption, when not enabled, is under 1A and ideal for portable applications. The extremely low output noise (30VRMS with 0.1F CNR) is ideal for powering VCOs. These devices are protected by thermal shutdown and foldback current limit.
APPLICATIONS
* * * * Portable/Battery-Powered Equipment Post-Regulation for Switching Supplies Noise-Sensitive Circuitry such as VCOs Point of Load Regulation for DSPs, FPGAs, ASICs, and Microprocessors
Optional VIN IN EN GND OUT TPS736xx NR Optional VOUT
DRB PACKAGE 3mm x 3mm SON (TOP VIEW) OUT 1 N/C 2 NR/FB 3 GND 4 8 IN 7 N/C 6 N/C 5 EN
DBV PACKAGE SOT23 (TOP VIEW)
IN GND EN 1 2 3 4 NR/FB 5 OUT
DCQ PACKAGE SOT223 (TOP VIEW)
TAB IS GND
1
2
3
4
5
Optional
IN
GND EN OUT NR/FB
Typical Application Circuit for Fixed Voltage Versions
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright (c) 2003-2005, Texas Instruments Incorporated
TPS736xx
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1)
PRODUCT TPS736xxyyyz VOUT (2) XX is nominal output voltage (for example, 25 = 2.5V, 01 = Adjustable (3)). YYY is package designator. Z is package quantity.
(1) (2) (3)
For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet or see the TI website at www.ti.com. Additional output voltages from 1.25V to 4.3V in 100mV increments are available on a quick-turn basis using innovative factory EEPROM programming. Minimum order quantities apply; contact factory for details and availability. For fixed 1.2V operation, tie FB to OUT.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
TPS736xx VIN range VEN range VOUT range Peak output current Output short-circuit duration Continuous total power dissipation Junction temperature range, TJ Storage temperature range ESD rating, HBM ESD rating, CDM (1) -0.3 to 6.0 -0.3 to 6.0 -0.3 to 5.5 Internally limited Indefinite See Dissipation Ratings Table -55 to +150 -65 to +150 2 500 C C kV V UNIT V V V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
POWER DISSIPATION RATINGS (1)
BOARD Low-K (2) High-K (3) Low-K (2) High-K (3) (4) (1) (2) (3) (4) PACKAGE DBV DBV DCQ DRB RJC 64C/W 64C/W 15C/W 1.2C/W RJA 255C/W 180C/W 53C/W 40C/W DERATING FACTOR ABOVE TA = 25C 3.9mW/C 5.6mW/C 18.9mW/C 25.0mW/C TA 25C POWER RATING 390mW 560mW 1.89W 2.50W TA = 70C POWER RATING 215mW 310mW 1.04W 1.38W TA = 85C POWER RATING 155mW 225mW 0.76W 1.0W
See Power Dissipation in the Applications section for more information related to thermal design. The JEDEC Low-K (1s) board design used to derive this data was a 3inch x 3inch, 2-layer board with 2-ounce copper traces on top of the board. The JEDEC High-K (2s2p) board design used to derive this data was a 3inch x 3inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on the top and bottom of the board. Based on preliminary thermal simulations.
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ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = -40C to +125C), VIN = VOUT(nom) + 0.5V (1), IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted. Typical values are at TJ = 25C.
PARAMETER VIN VFB Input voltage range (1) (2) Internal reference (TPS73601) Output voltage range (TPS73601) VOUT Accuracy (1) VOUT%/VIN VOUT%/IOUT VDO ZO(DO) ICL ISC IREV IGND ISHDN IFB PSRR VN tSTR VEN(HI) VEN(LO) IEN(HI) TSD TJ (1) (2) (3) (4) Nominal over VIN, IOUT, and T TJ = 25C VOUT + 0.5V VIN 5.5V; 10mA IOUT 400mA VO(nom) + 0.5V VIN 5.5V 1mA IOUT 400mA 10mA IOUT 400mA IOUT = 400mA 1.7V VIN VOUT + VDO VOUT = 0.9 x VOUT(nom) 3.6V VIN 4.2V, 0C TJ 70C VOUT = 0V (-IIN) VEN 0.5V, 0V VIN VOUT IOUT = 10mA (IQ) IOUT = 400mA VEN 0.5V, VOUT VIN 5.5 f = 100Hz, IOUT = 400mA f = 10KHz, IOUT = 400mA COUT = 10F, No CNR COUT = 10F, CNR = 0.01F VOUT = 3V, RL = 30 COUT = 1F, CNR = 0.01F 1.7 0 VEN = 5.5V Shutdown, temperature increasing Reset, temperature decreasing -40 0.02 160 140 125 400 500 450 0.1 400 800 0.02 0.1 58 37 27 x VOUT 8.5 x VOUT 600 VIN 0.5 0.1 10 550 1000 1 0.3 TJ = 25C TEST CONDITIONS MIN 1.7 1.198 VFB -0.5 -1.0 0.5 0.01 0.002 0.0005 75 0.25 650 800 800 200 1.20 TYP MAX 5.5 1.210 5.5 - VDO +0.5 +1.0 % %/V %/mA mV mA mA mA A A A A dB VRMS s V V A C C UNIT V V V
Line regulation (1) Load regulation Dropout voltage (3) (VIN = VOUT(nom) - 0.1V) Output impedance in dropout Output current limit Short-circuit current Reverse leakage current (4)
Ground pin current Shutdown current (IGND) FB pin current (TPS73601) Power-supply rejection ratio (ripple rejection) Output noise voltage BW = 10Hz - 100KHz Startup time Enable high (enabled) Enable low (shutdown) Enable pin current (enabled) Thermal shutdown temperature Operating junction temperature
Minimum VIN = VOUT +VDO or 1.7V, whichever is greater. For VOUT(nom) <1.6V, when VIN 1.6V, the output will lock to VIN and may result in a damaging over-voltage level on the output. To avoid this situation, disable the device before powering down the VIN. VDO is not measured for the TPS73615 (VOUT(nom) = 1.5V) since minimum VIN = 1.7V. Refer to Applications section for more information.
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FUNCTIONAL BLOCK DIAGRAMS
IN
4MHz Charge Pump EN Ref Servo 27k Bandgap Error Amp Current Limit GND 8k R1 OUT Thermal Protection
R1 + R2 = 80k
R2
NR
Figure 1. Fixed Voltage Version
IN
Table 1. Standard 1% Resistor Values for Common Output Voltages
VO 1.2V 1.5V R1 Short 23.2k 28.0k 39.2k 44.2k 46.4k 52.3k R2 Open 95.3k 56.2k 36.5k 33.2k 30.9k 30.1k
4MHz Charge Pump EN Ref Servo 27k Bandgap Error Amp Current Limit GND 8k 80k R1 FB R2 OUT Thermal Protection
1.8V 2.5V 2.8V 3.0V 3.3V
NOTE: VOUT = (R1 + R2)/R2 x 1.204; R1R2 19k for best accuracy.
Figure 2. Adjustable Voltage Version
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PIN ASSIGNMENTS
DBV PACKAGE SOT23 (TOP VIEW) DCQ PACKAGE SOT223 (TOP VIEW) TAB IS GND DRB PACKAGE 3mm x 3mm SON (TOP VIEW) OUT 1 IN GND EN 1 2 3 4 NR/FB 1 2 3 4 5 5 OUT N/C 2 NR/FB 3 GND 4 8 IN 7 N/C 6 N/C 5 EN
IN OUT
GND EN NR/FB
Terminal Functions
SOT23 (DBV) PIN NO. 1 2 3 SOT223 (DCQ) PIN NO. 1 3 5 3x3 SON (DRB) PIN NO. 8 4, Pad 5
NAME IN GND EN
DESCRIPTION Unregulated input supply Ground Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown mode. Refer to the Shutdown section under Applications Information for more details. EN can be connected to IN if not used. Fixed voltage versions only--connecting an external capacitor to this pin bypasses noise generated by the internal bandgap, reducing output noise to very low levels. Adjustable voltage version only--this is the input to the control loop error amplifier, and is used to set the output voltage of the device. Output of the Regulator. There are no output capacitor requirements for stability.
NR FB OUT
4 4 5
4 4 2
3 3 1
5
TPS736xx
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TYPICAL CHARACTERISTICS
For all voltage versions, at TJ = +25C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted.
LOAD REGULATION
0.5 0.4 0.3 Change in VOUT (%) 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0 50 100 150 200 IOUT (mA) 250 300 350 400 Referred to IOUT = 10mA -40_C +25_C +125_ C 0.15 Change in VOUT (%) 0.10 0.05 0 -0.05 -0.10 -0.15 -0.20 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VIN - VOUT (V) -40_ C +125_C +25_ C 0.20 Referred to VIN = VOUT + 0.5V at IOUT = 10mA
LINE REGULATION
Figure 3. DROPOUT VOLTAGE vs OUTPUT CURRENT
100 TPS73625DBV 80 +125_ C 80 100 TPS73625DBV
Figure 4. DROPOUT VOLTAGE vs TEMPERATURE
VDO (mV)
+25_ C 40 -40_C
VDO (mV)
60
60
40
20
20
0 0 50 100 150 200 IOUT (mA) 250 300 350 400
0 -50
-25
0
25
50
75
100
125
Temperature (_C)
Figure 5. OUTPUT VOLTAGE ACCURACY HISTOGRAM
30 IOUT = 10mA 25 14 Percent of Units (%) 20 15 10 5 2 0 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 Percent of Units (%) 12 10 8 6 4 18 16 IOUT = 10mA All Voltage Versions
Figure 6. OUTPUT VOLTAGE DRIFT HISTOGRAM
VOUT Error (%)
Figure 7.
6
-100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Worst Case dVOUT/dT (ppm/_C)
Figure 8.
TPS736xx
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted.
GROUND PIN CURRENT vs OUTPUT CURRENT
1000 900 800 700 IGND (A) I GND (A) 600 500 400 300 200 100 0 0 100 200 IOUT (mA) 300 400 VIN = 5.5V VIN = 4V VIN = 2V 1000 900 800 700 600 500 400 300 200 100 0 -50 -25 0 25 50 75 VIN = 5.5V VIN = 3V VIN = 2V 100 125 IOUT = 400mA
GROUND PIN CURRENT vs TEMPERATURE
Temperature (_C)
Figure 9. CURRENT LIMIT vs VOUT (FOLDBACK)
800 700 Current Limit (mA) 600 500 400 300 200 100 TPS73633 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VOUT (V) 0.01 -50 -25 0 ISC ICL 1 VENABLE = 0.5V VIN = VO + 0.5V
Figure 10. GROUND PIN CURRENT in SHUTDOWN vs TEMPERATURE
IGND (A)
0.1
25
50
75
100
125
Temperature (_C)
Figure 11. CURRENT LIMIT vs VIN
800 750 Current Limit (mA) Current Limit (mA) 700 650 600 550 500 450 400 1.5 2.0 2.5 3.0 3.5 VIN (V) 4.0 4.5 5.0 5.5 800 750 700 650 600 550 500 450 400 -50 -25
Figure 12. CURRENT LIMIT vs TEMPERATURE
0
25
50
75
100
125
Temperature (_C)
Figure 13.
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted.
PSRR (RIPPLE REJECTION) vs FREQUENCY
90 80 Ripple Rejection (dB) 70 60 50 40 30 20 10 0 10 100 1k IOUT = Any COUT = 0F 10k 100k I OUT = 100mA COUT = 10F IOUT = 1mA C OUT = Any IOUT = 100mA COUT = Any IOUT = 1mA COUT = 10F IO = 100mA CO = 1F IOUT = 1mA COUT = 1F 40 35 30 PSRR (dB) 25 20 15 10 5 0 1M 10M 0 Frequency = 100kHz COUT = 10F VOUT = 2.5V 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
PSRR (RIPPLE REJECTION) vs VIN- VOUT
Frequency (Hz)
VIN - VOUT (V)
Figure 15. NOISE SPECTRAL DENSITY CNR = 0F
1 C OUT = 1F 1
Figure 16. NOISE SPECTRAL DENSITY CNR = 0.01F
eN (V/Hz)
eN (V/Hz)
COUT = 0F 0.1 COUT = 10F
COUT = 1F 0.1
COUT = 0F COUT = 10F IOUT = 150mA 0.01 10 100 1k Frequency (Hz) 10k 100k 0.01 10 100 1k Frequency (Hz) 10k 100k IOUT = 150mA
Figure 17. RMS NOISE VOLTAGE vs COUT
60 50 40 VN (RMS) VN (RMS) 30 20 VOUT = 1.5V 10 0 CNR = 0.01F 10Hz < Frequency < 100kHz 0.1 1 COUT (F) 10 40 20 0 VOUT = 1.5V VOUT = 3.3V 140 VOUT = 5.0V 120 VOUT = 5.0V 100 80 60 VOUT = 3.3V
Figure 18. RMS NOISE VOLTAGE vs CNR
COUT = 0F 10Hz < Frequency < 100kHz 1p 10p 100p CNR (F) 1n 10n
Figure 19.
Figure 20.
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted.
TPS73633 LOAD TRANSIENT RESPONSE
VIN = 3.8V 100mV/tick COUT = 0F VOUT 50mV/div 50mV/tick COUT = 1F VOUT COUT = 100F 5.5V 400mA 50mA/tick 10mA 10s/div IOUT 1V/div 4.5V 10s/div dVIN dt VIN COUT = 0F VOUT
TPS73633 LINE TRANSIENT RESPONSE
IOUT = 400mA
20mV/tick
COUT = 10F
VOUT
50mV/div
VOUT = 0.5V/s
Figure 21. TPS73633 TURN-ON RESPONSE
RL = 1k CO UT = 0F
Figure 22. TPS73633 TURN-OFF RESPONSE
VOUT 1V/div
R L = 20 C OUT = 10F R L = 20 C OUT = 1F R L = 1k C OUT = 0F
1V/div
RL = 20 COUT = 1F RL = 20 COUT = 10F
VOUT VEN 1V/div 2V
2V 1V/div 0V
0V
VEN 100s/div
100s/div
Figure 23. TPS73633 POWER UP / POWER DOWN
6 5 4 3 Volts 2 1 0 -1 -2 50ms/div 0.01 -50 -25 VIN VOUT IENABLE (nA) 1 10
Figure 24. IENABLE vs TEMPERATURE
0.1
0
25
50
75
100
125
Temperature (_ C)
Figure 25.
Figure 26.
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted.
TPS73601 RMS NOISE VOLTAGE vs CADJ
60 55 50 VN (rms) 45 40 35 30 25 VOUT = 2.5V COUT = 0F R1 = 39.2k 10Hz < Frequency < 100kHz 100p CFB (F) 1n 10n IFB (nA) 160 140 120 100 80 60 40 20 0 -50 -25
TPS73601 IFB vs TEMPERATURE
20 10p
0
25
50
75
100
125
Temperature (_C)
Figure 27. TPS73601 LOAD TRANSIENT, ADJUSTABLE VERSION
CFB = 10nF R1 = 39.2k 200mV/div COUT = 0F VOUT 100mV/div
Figure 28. TPS73601 LINE TRANSIENT, ADJUSTABLE VERSION
VOUT = 2.5V CFB = 10nF VOUT
COUT = 0F
100mV/div 200mV/div COUT = 10F VOUT
COUT = 10F
VOUT
4.5V 400mA 10mA 25s/div IOUT 5s/div 3.5V VIN
Figure 29.
Figure 30.
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APPLICATION INFORMATION
The TPS736xx belongs to a family of new generation LDO regulators that use an NMOS pass transistor to achieve ultra-low-dropout performance, reverse current blockage, and freedom from output capacitor constraints. These features, combined with low noise and an enable input, make the TPS736xx ideal for portable applications. This regulator family offers a wide selection of fixed output voltage versions and an adjustable output version. All versions have thermal and over-current protection, including foldback current limit. Figure 31 shows the basic circuit connections for the fixed voltage models. Figure 32 gives the connections for the adjustable output version (TPS73601). R1 and R2 can be calculated for any output voltage using the formula in Figure 32. Sample resistor values for common output voltages are shown in Figure 2. For best accuracy, make the parallel combination of R1 and R2 approximately 19k.
Optional input capacitor. May improve source impedance, noise, or PSRR. VIN IN EN GND Optional output capacitor. May improve load transient, noise, or PSRR. OUT TPS736xx NR VOUT
Input and Output Capacitor Requirements
Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1F to 1F low ESR capacitor across the input supply near the regulator. This will counteract reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated or the device is located several inches from the power source. The TPS736xx does not require an output capacitor for stability and has maximum phase margin with no capacitor. It is designed to be stable for all available types and values of capacitors. In applications where VIN - VOUT < 0.5V and multiple low ESR capacitors are in parallel, ringing may occur when the product of COUT and total ESR drops below 50nF. Total ESR includes all parasitic resistances, including capacitor ESR and board, socket, and solder joint resistance. In most applications, the sum of capacitor ESR and trace resistance will meet this requirement.
Output Noise
A precision band-gap reference is used to generate the internal reference voltage, VREF. This reference is the dominant noise source within the TPS736xx and it generates approximately 32VRMS (10Hz to 100kHz) at the reference output (NR). The regulator control loop gains up the reference noise with the same gain as the reference voltage, so that the noise voltage of the regulator is approximately given by:
V N o 32WVRMS (R1 * R2) o 32WVRMS R2 VOUT VREF
Optional bypass capacitor to reduce output noise.
Figure 31. Typical Application Circuit for Fixed-Voltage Versions
(1)
Optional input capacitor. May improve source impedance, noise, or PSRR. VIN IN OUT TPS736xx GND FB
Optional output capacitor. May improve load transient, noise, or PSRR. VOUT R1 CFB
Since the value of VREF is 1.2V, this relationship reduces to: WV V N(WVRMS) * 27o RMS V OUT(V) V (2) for the case of no CNR. An internal 27k resistor in series with the noise reduction pin (NR) forms a low-pass filter for the voltage reference when an external noise reduction capacitor, CNR, is connected from NR to ground. For CNR = 10nF, the total noise in the 10Hz to 100kHz bandwidth is reduced by a factor of ~3.2, giving the approximate relationship: WV V N(WVRMS) * 8.5o RMS V OUT(V) V (3) for CNR = 10nF.
EN
R2 VOUT = (R1 + R2) R1 x 1.204 Optional capacitor reduces output noise and improves transient response.
Figure 32. Typical Application Circuit for Adjustable-Voltage Versions
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This noise reduction effect is shown as RMS Noise Voltage vs CNR in the Typical Characteristics section. The TPS73601 adjustable version does not have the noise-reduction pin available. However, connecting a feedback capacitor, CFB , from the output to the FB pin will reduce output noise and improve load transient performance. The TPS736xx uses an internal charge pump to develop an internal supply voltage sufficient to drive the gate of the NMOS pass element above VOUT. The charge pump generates ~250V of switching noise at ~4MHz; however, charge-pump noise contribution is negligible at the output of the regulator for most values of IOUT and COUT.
For large step changes in load current, the TPS736xx requires a larger voltage drop from VIN to VOUT to avoid degraded transient response. The boundary of this transient dropout region is approximately twice the dc dropout. Values of VIN - VOUT above this line insure normal transient response. Operating in the transient dropout region can cause an increase in recovery time. The time required to recover from a load transient is a function of the magnitude of the change in load current rate, the rate of change in load current, and the available headroom (VIN to VOUT voltage drop). Under worst-case conditions [full-scale instantaneous load change with (VIN - VOUT) close to dc dropout levels], the TPS736xx can take a couple of hundred microseconds to return to the specified regulation accuracy.
Board Layout Recommendation to Improve PSRR and Noise Performance
To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device.
Transient Response
The low open-loop output impedance provided by the NMOS pass element in a voltage follower configuration allows operation without an output capacitor for many applications. As with any regulator, the addition of a capacitor (nominal value 1F) from the output pin to ground will reduce undershoot magnitude but increase duration. In the adjustable version, the addition of a capacitor, CFB, from the output to the adjust pin will also improve the transient response. The TPS736xx does not have active pull-down when the output is over-voltage. This allows applications that connect higher voltage sources, such as alternate power supplies, to the output. This also results in an output overshoot of several percent if load current quickly drops to zero when a capacitor is connected to the output. The duration of overshoot can be reduced by adding a load resistor. The overshoot decays at a rate determined by output capacitor COUT and the internal/external load resistance. The rate of decay is given by:
(Fixed Voltage Version)
Internal Current Limit
The TPS736xx internal current limit helps protect the regulator during fault conditions. Foldback helps to protect the regulator from damage during output short-circuit conditions by reducing current limit when VOUT drops below 0.5V. See Figure 11 in the Typical Characteristics section for a graph of IOUT vs VOUT.
Shutdown
The Enable pin is active high and is compatible with standard TTL-CMOS levels. VEN below 0.5V (max) turns the regulator off and drops the ground pin current to approximately 10nA. When shutdown capability is not required, the Enable pin can be connected to VIN. When a pull-up resistor is used, and operation down to 1.8V is required, use pull-up resistor values below 50k.
dV dt *
C OUT
VOUT 80kW o R LOAD V OUT 80kW (R 1 * R 2) R LOAD
(4)
(Adjustable Voltage Version)
Dropout Voltage
The TPS736xx uses an NMOS pass transistor to achieve extremely low dropout. When (VIN - VOUT) is less than the dropout voltage (VDO), the NMOS pass device is in its linear region of operation and the input-to-output resistance is the RDS-ON of the NMOS pass element.
dV dt o
C OUT
(5)
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Reverse Current
The NMOS pass element of the TPS736xx provides inherent protection against current flow from the output of the regulator to the input when the gate of the pass device is pulled low. To ensure that all charge is removed from the gate of the pass element, the enable pin must be driven low before the input voltage is removed. If this is not done, the pass element may be left on due to stored charge on the gate. After the enable pin is driven low, no bias voltage is needed on any pin for reverse current blocking. Note that reverse current is specified as the current flowing out of the IN pin due to voltage applied on the OUT pin. There will be additional current flowing into the OUT pin due to the 80k internal resistor divider to ground (see Figure 1 and Figure 2). For the TPS73601, reverse current may flow when VFB is more than 1.0V above VIN.
expected ambient temperature and worst-case load. The internal protection circuitry of the TPS736xx has been designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the TPS736xx into thermal shutdown will degrade reliability.
Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low and high K boards are shown in the Power Dissipation Ratings table. Using heavier copper will increase the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers will also improve the heat-sink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the output current times the voltage drop across the output pass element (VIN to VOUT):
P D o (VIN * VOUT) I OUT
(6)
Thermal Protection
Thermal protection disables the output when the junction temperature rises to approximately 160C, allowing the device to cool. When the junction temperature cools to approximately 140C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This limits the dissipation of the regulator, protecting it from damage due to overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable operation, junction temperature should be limited to 125C maximum. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least 35C above the maximum expected ambient condition of your application. This produces a worst-case junction temperature of 125C at the highest
Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage.
Package Mounting
Solder pad footprint recommendations for the TPS736xx are presented in Application Bulletin Solder Pad Recommendations for Surface-Mount Devices (AB-132), available from the Texas Instruments web site at www.ti.com.
13
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
PACKAGING INFORMATION
Orderable Device TPS73601DBVR TPS73601DBVRG4 TPS73601DBVT TPS73601DBVTG4 TPS73601DCQ TPS73601DCQR TPS73601DCQRG4 TPS73601DRBR TPS73601DRBRG4 TPS73601DRBT TPS73601DRBTG4 TPS736125DRBR TPS736125DRBRG4 TPS736125DRBT TPS736125DRBTG4 TPS73615DBVR TPS73615DBVRG4 TPS73615DBVT TPS73615DBVTG4 TPS73615DCQ TPS73615DCQR TPS73615DRBR TPS73615DRBRG4 TPS73615DRBT TPS73615DRBTG4 Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOT-23 SOT-23 SOT-23 SOT-23 SOP SOP SOP SON SON SON SON SON SON SON SON SOT-23 SOT-23 SOT-23 SOT-23 SOP SOP SON SON SON SON Package Drawing DBV DBV DBV DBV DCQ DCQ DCQ DRB DRB DRB DRB DRB DRB DRB DRB DBV DBV DBV DBV DCQ DCQ DRB DRB DRB DRB Pins Package Eco Plan (2) Qty 5 5 5 5 6 6 6 8 8 8 8 8 8 8 8 5 5 5 5 6 6 8 8 8 8 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
Orderable Device TPS73618DBVR TPS73618DBVRG4 TPS73618DBVT TPS73618DCQ TPS73618DCQR TPS73625DBVR TPS73625DBVRG4 TPS73625DBVT TPS73625DBVTG4 TPS73625DCQ TPS73625DCQG4 TPS73625DCQR TPS73625DCQRG4 TPS73630DBVR TPS73630DBVRG4 TPS73630DBVT TPS73630DCQ TPS73630DCQG4 TPS73630DCQR TPS73630DCQRG4 TPS73632DBVR TPS73632DBVRG4 TPS73632DBVT TPS73632DBVTG4 TPS73633DBVR TPS73633DBVRG4 TPS73633DBVT
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOT-23 SOT-23 SOT-23 SOP SOP SOT-23 SOT-23 SOT-23 SOT-23 SOP SOP SOP SOP SOT-23 SOT-23 SOT-23 SOP SOP SOP SOP SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23
Package Drawing DBV DBV DBV DCQ DCQ DBV DBV DBV DBV DCQ DCQ DCQ DCQ DBV DBV DBV DCQ DCQ DCQ DCQ DBV DBV DBV DBV DBV DBV DBV
Pins Package Eco Plan (2) Qty 5 5 5 6 6 5 5 5 5 6 6 6 6 5 5 5 6 6 6 6 5 5 5 5 5 5 5 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 78 2500 Green (RoHS & no Sb/Br) TBD TBD
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-3-240C-168 HR Level-3-240C-168 HR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 Green (RoHS &
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
Orderable Device
Status (1)
Package Type SOT-23 SOP SOP SOP SOP SON SON SON SON SOT-23 SOT-23 SOT-23 SOT-23
Package Drawing DBV DCQ DCQ DCQ DCQ DRB DRB DRB DRB DBV DBV DBV DBV
Pins Package Eco Plan (2) Qty no Sb/Br) 5 6 6 6 6 8 8 8 8 5 5 5 5 250 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
TPS73633DBVTG4 TPS73633DCQ TPS73633DCQG4 TPS73633DCQR TPS73633DCQRG4 TPS73633DRBR TPS73633DRBRG4 TPS73633DRBT TPS73633DRBTG4 TPS73643DBVR TPS73643DBVRG4 TPS73643DBVT TPS73643DBVTG4
(1)
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
CU NIPDAU Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2005
Orderable Device
Status (1)
Package Type SON SON SON SOT-23 SOT-23 SOT-23 SOT-23
Package Drawing DRB DRB DRB DBV DBV DBV DBV
Pins Package Eco Plan (2) Qty no Sb/Br) 8 8 8 5 5 5 5 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
TPS73633DRBRG4 TPS73633DRBT TPS73633DRBTG4 TPS73643DBVR TPS73643DBVRG4 TPS73643DBVT TPS73643DBVTG4
(1)
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
PACKAGING INFORMATION
Orderable Device TPS73601DBVR TPS73601DBVRG4 TPS73601DBVT TPS73601DBVTG4 TPS73601DCQ TPS73601DCQR TPS73601DCQRG4 TPS73601DRBR TPS73601DRBRG4 TPS73601DRBT TPS73601DRBTG4 TPS736125DRBR TPS736125DRBRG4 TPS736125DRBT TPS736125DRBTG4 TPS73615DBVR TPS73615DBVRG4 TPS73615DBVT TPS73615DBVTG4 TPS73615DCQ TPS73615DCQR TPS73615DRBR TPS73615DRBRG4 TPS73615DRBT TPS73615DRBTG4 Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOT-23 SOT-23 SOT-23 SOT-23 SOT-223 SOT-223 SOT-223 SON SON SON SON SON SON SON SON SOT-23 SOT-23 SOT-23 SOT-23 SOT-223 SOT-223 SON SON SON SON Package Drawing DBV DBV DBV DBV DCQ DCQ DCQ DRB DRB DRB DRB DRB DRB DRB DRB DBV DBV DBV DBV DCQ DCQ DRB DRB DRB DRB Pins Package Eco Plan (2) Qty 5 5 5 5 6 6 6 8 8 8 8 8 8 8 8 5 5 5 5 6 6 8 8 8 8 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
Orderable Device TPS73618DBVR TPS73618DBVRG4 TPS73618DBVT TPS73618DBVTG4 TPS73618DCQ TPS73618DCQR TPS73625DBVR TPS73625DBVRG4 TPS73625DBVT TPS73625DBVTG4 TPS73625DCQ TPS73625DCQG4 TPS73625DCQR TPS73625DCQRG4 TPS73630DBVR TPS73630DBVRG4 TPS73630DBVT TPS73630DCQ TPS73630DCQG4 TPS73630DCQR TPS73630DCQRG4 TPS73632DBVR TPS73632DBVRG4 TPS73632DBVT TPS73632DBVTG4 TPS73633DBVR
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOT-23 SOT-23 SOT-23 SOT-23 SOT-223 SOT-223 SOT-23 SOT-23 SOT-23 SOT-23 SOT-223 SOT-223 SOT-223 SOT-223 SOT-23 SOT-23 SOT-23 SOT-223 SOT-223 SOT-223 SOT-223 SOT-23 SOT-23 SOT-23 SOT-23 SOT-23
Package Drawing DBV DBV DBV DBV DCQ DCQ DBV DBV DBV DBV DCQ DCQ DCQ DCQ DBV DBV DBV DCQ DCQ DCQ DCQ DBV DBV DBV DBV DBV
Pins Package Eco Plan (2) Qty 5 5 5 5 6 6 5 5 5 5 6 6 6 6 5 5 5 6 6 6 6 5 5 5 5 5 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
Orderable Device TPS73633DBVRG4 TPS73633DBVT TPS73633DBVTG4 TPS73633DCQ TPS73633DCQG4 TPS73633DCQR TPS73633DCQRG4 TPS73633DRBR TPS73633DRBRG4 TPS73633DRBT TPS73633DRBTG4 TPS73643DBVR TPS73643DBVRG4 TPS73643DBVT TPS73643DBVTG4
(1)
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOT-23 SOT-23 SOT-23 SOT-223 SOT-223 SOT-223 SOT-223 SON SON SON SON SOT-23 SOT-23 SOT-23 SOT-23
Package Drawing DBV DBV DBV DCQ DCQ DCQ DCQ DRB DRB DRB DRB DBV DBV DBV DBV
Pins Package Eco Plan (2) Qty 5 5 5 6 6 6 6 8 8 8 8 5 5 5 5 3000 Green (RoHS & no Sb/Br) 250 250 78 78 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR Level-2-260C-1 YEAR
2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 250 250 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Interface Logic Power Mgmt Microcontrollers amplifier.ti.com dataconverter.ti.com dsp.ti.com interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com Applications Audio Automotive Broadband Digital Control Military Optical Networking Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

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